Description :
XG-40 10CC BGA Solder Flux Paste Soldering Tin Cream Sn63/Pb37 25-45um
New technical support, unique chemical formula provides excellent wetting, to ensure high reliability.
More advanced insulation technology, tack lasting, easy to change to dry, the viscous time up to 48 hours or more.
High-end quality with unique formula, perfect performance, easy to weld, solder joint is bright and full, no Weld, false welding phenomenon.
The residue is colorless and transparent, does not affect the detection.
Anti-dry, relatively long shelf life at room temperature, adapted to the mobile phone repair industry, the computer digital service industry, high-precision circuit board SMT soldering, BGA welding process, and so on!
Unique high-quality solder paste (the best configuration Ingredients: Sn63/Pb37), fine and flexible packaging (10 cc / support).
Alloy : Sn63/Pb37
Microns : 25-45um
Net : 10CC
Package includes :
1x XG-40 10CC BGA Solder Flux Paste
Please note it will need about 12~20days for the delivery!
Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers control.
Thank you for your understanding!
Returns / Change of Mind Policy: We 100% support our customers, If you are not satisfied, you may return any item within 30 days of delivery. If the product is no problem, all shipping charges must be paid by customer for returns. If you have any problem with our products, please CONTACT US at once.
Estimated Delivery Time Frame: 12-20 business days