Features:
3D laser square hole BGA reballing stencil template.
High-speed numerical control technology and high-temperature resistant toughened materials production,round square precise hole posttion,make steel net more durable,easier to take off the net,more efficient.
New patented iphone X Middle Layer Motherboard for iPhone X Middle layer motherboard.
Assisting professionals to do iPhone X BGA reballing in the most convenient and safest way.
Package included:
1 xBGA Reballing Tool
Please note it will need about 12~20days for the delivery!
Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers control.
Thank you for your understanding!
Returns / Change of Mind Policy: We 100% support our customers, If you are not satisfied, you may return any item within 30 days of delivery. If the product is no problem, all shipping charges must be paid by customer for returns. If you have any problem with our products, please CONTACT US at once.
Estimated Delivery Time Frame: 12-20 business days