1. Thermal Conductivity: The primary purpose of thermal paste is to enhance the thermal conductivity between the heat-generating component (CPU or GPU) and the heatsink or cooling solution.

2. Application: The TF3 paste is applied between the CPU/GPU and the heatsink or radiator to facilitate efficient heat transfer and dissipation.

3. Quantity: The 2g quantity is typically enough for multiple applications. Only a small amount of thermal paste is usually needed for each use.

4. Thermal Resistance: The paste aims to reduce thermal resistance, ensuring that heat is effectively transferred from the electronic component to the cooling solution.

5. Non-Conductive: Quality thermal pastes are typically non-conductive to prevent any electrical issues when applied between electronic components.

6. Ease of Application: The TF3 paste is designed for easy application. Some thermal pastes come with applicator tools, making it convenient for users to apply the paste accurately.

7. Compatibility: The TF3 thermal paste is likely compatible with a range of CPU and GPU sockets. Ensure compatibility with your specific hardware before applying.

8. Temperature Range: The paste should function effectively within a specified temperature range, ensuring stability under normal operating conditions.

9. Performance: Check for information on the thermal conductivity performance, indicating how well the thermal paste facilitates heat transfer.

10. Longevity: The thermal paste is expected to maintain its effectiveness over time, contributing to long-term stable thermal performance.

11. Storage: Proper storage conditions are essential to maintain the effectiveness of the thermal paste. Follow any specific storage instructions provided by the manufacturer.